Specification:
Item Type: Thermal Silicone Heatsink Pad
Material: Silicone
Thermal Conductivity: 5.0
Density: 2.35
Hardness: 30
Dielectric Constant: 26018
Temperature.: -40 ~ 220
Hardness: 13c ~ 50C
Flame Retardancy: UL94 V0
Tensile strength (PSI)35
Size: Approx. 100 x 100 x 1mm / 3.94 x 3.94 x 0.04in
Features:
1High temperature resistance and low temperature, with good thermal conductivity. 2This product can be used for CPU chip heat conduction or LED heat conduction. 3This thermal silicone heatsink pad with good heat conduction and has good malleability. 4Using highquality materials, strong and durable, has a long service life 5Small size, easy to carry and store, convenient to use and with good performance
Package List:
2 x Thermal Silicone Heatsink Pad
