Specification:
Condition: 100% brand new
Item type: Low Temperature Tin Paste
Material: ABS + solder paste
Color: As picture shown
Weight: Approx. 44g
Model: SFD-231
Ingredients: Sn42/Bi58
Particles: 25-45um (No. 3 powder)
Application: mobile phone hard disk CPU IC, etc.
Melting point: 138
Features: for mobile phone repair
Features:
1It has strong continuous printing performance, suitable for welding fine pitch IC and for BGA and relatively precise components. 2Good wettability and mold release, cold collapse resistance, hot collapse resistance, strong dry resistance. 3Suitable for PCB welding of many high-required materials, fine pitch and high-precision components, and there is little displacement problem of even tin tombstone. 4Tin is full and bright, tin beads, little residue, white and transparent, no fluorine and other highly corrosive substances. 5Professional manufacturing, stable performance and high reliability.
Package List:
1 x Low Temperature Tin Paste
