Specification:
Condition: 100% Brand New
Item Type: Solder Paste
Material: ABS, Solder Paste
Color: As Pictures Shown
Weight: Approx. 42g(One Piece With Tube)
Model: SFD-227
Ingredients: SN96.5 / AG3 / CU0.5
Grain :20-38um (No. 4 Powder)
Applicable: Mobile Phone Hard Disk CPU, IC, etc
Melting Point: 217C
Function: for Mobile Phone Maintenance
Features:
1Strong continuous printing performance, suitable for welding fine pitch IC, for BGA and relatively precise components. 2Good wettability and mold release, strong resistance to cold and hot collapse, it is dry resistance. 3Suitable for PCB welding with various high-required materials, fine pitch and high-precision components, and there is little phenomenon of shifting and short tombstoning. 4The tin is full of bright tin beads, the residue is less white and transparent, and there is no strong corrosive substances such as fluorine. 5It is active and rinse-free with less residual, high in antioxidants.
Package List:
1 x High Temperature Solder Paste
