Specification:
Item Type: Heat Sink
Material: 6063-T5 Extruded Aluminum Profile
Color: Gold
Mounting: Back with thermal conductive adhesive
Features:
1Designed to maximize surface area in contact with cooling air. 2Can reduce the risk of hardware failure due to overheating. 3Stamped and formed by high-quality aluminum profile, with good thermal conductivity. 4Back with thermal conductive adhesive for convenient installation. 5Applicable for motherboard CPU, MOS module, transistor, power supply, electron tube, PCB power board, video memory, electrical, electronic components.
Package List:
20 x Heat Sink
