Specification:
Item Type: BGA Reballing Stencil
Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU
Applicable Models: For S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc.
Features:
1[Applicable CPU] This CPU reballing stencil is applicable for Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU. 2[Suitable Model] This BGA reballing template is suitable for S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc. phones. 3[Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners. 4[Precise Positioning] Precisely made, the reballing template will accurately locate the CPU, with fast tin planting speed and high efficiency. 5[Stainless Steel Material] Made from stainless steel, the reballing stencil is high temperature resistant, will not easily deform.
Package List:
1 x BGA Reballing Stencil
