Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For A13
Applicable Product Models: For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max.
Features:
1Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. 2Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3Perfect Fitting: Allows for wide application on for A13 CPU as well as for For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max, very useful. 4Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
Package List:
1 x Phone CPU BGA Reballing Stencil
