Specification:
Item Type: Phone CPU BGA Reballing Stencil
Product Material: Stainless Steel
Spacing: 0.12mm
Applicable CPU: For SDM450, 660, SM6150, MT6762 CPU.
Applicable Product Model: For A60-A90 series, A10S, A605F, A705F, A920F.
Features:
1Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. 2Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3Perfect Fitting: Allows for wide application on for SDM450, 660, SM6150, MT6762 CPU as well as for A60A90 series, A10S, A605F, A705F and more. 4Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
Package List:
1 x Phone CPU BGA Reballing Stencil
