Specification:
Item Type: Phone Tin Reballing Stencil
Material: Stainless steel
Pitch: Approx. 0.12mm / 0.005in
Suitable CPU: For Kirin 990(For Hi 3690)
Suitable Models: For HUAWEI P40, for P40 pro, for mate30 for mate30 Pro, for mate30 RS, for nova 6 and for Honor V30, for V30 Pro and so on.
Features:
1[Suitable Models] This tin reballing stencil is suitable for HUAWEI P40, for P40 pro, for mate30 for mate30 Pro, for mate30 RS, for nova 6 and for Honor V30, for V30 Pro and so on. 2[Fast Plating Speed] Our tin reballing stencil will not change under high temperature and fast tin plating speed, so that the efficiency of tin plating can be improved. 3[Multiple IC Slots] The tin stencil is equipped with multiple IC recess on the stencil body with half engraving process, which effectively prevents small IC from sticking to tin and protecting small IC from breaking corners. 4[Accurate Positioning] Tin plating stencil can be precisely positioned and has a great appearance, allowing you to use it in different situations. 5[Compact and Lightweight] CPU tin plating stencil is very compact and lightweight, you can do it on the go, easy to use, is a good maintenance and DIY tools.
Package List:
1 x Phone Tin Reballing Stencil
