Specification:
Item Type: BGA Reballing Rework Station
Purpose: BGA chip planting ball
Specification: KF-13 double frame type 80 x 80 tin planting station
Plantable Chip Size: Maximum Size: Approx. 50 x 50mm / 2 x 2in
Applicable Steel Mesh Size: Approx. 80 x 80mm / 3.1 x 3.1in
Features: Aluminum alloy frame, light and durable material, accurate bearing guidance, accurate positioning.
Features:
1Using aluminum alloy material frame, the structure is light and durable. 2The designed of the diversion solt of the upper cover frame can facilitate the pouring out of the excess solder balls. 3The large load card slot designed of the upper cover, the maximum can accommodate the core 50 x 50mm 4Double frame ball planting table, one more frame, easy to replace, and one more net spare, which greatly improves work efficiency and reduces the frequency of net changing. 5Complete tools, you can operate it yourself, suitable for DIY enthusiasts
Package List:
1 x BGA Reballing Rework Station(Composed of 3 Accessories)
1 x Hex Wrench
