Specification:
Item Type: BGA LeadFree Solder Ball
Product Composition: Sn96.5%/Ag3%/Cu0.5%
Specification: Approx. 0.6mm / 0.02in 250,000 grains
Purpose: Chip planting beads and ball planting
Scope of Application: BGA package soldering, filling, maintenance, ball planting
Features:
1Mainly used to connect semiconductor wafers, circuit templates and PCB boards, and transmit electronic signals with ultrasmall spherical tin electronic parts. 2The diameter of the solder ball for IC packaging is approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in. 3Add trace elements to the solder balls to improve the oxidation ability and reliability of the solder balls 4Environmentally friendly leadfree, refined materials, strengthened solder ball soldering capabilities 5A large number, can meet your use and replacement needs, very practically.
Package List:
1 Bottle of Tin Balls
