Specification:
Item Type: Solder Paste Flux
Material: Tin
Purpose: Mobile phone chip repair, computer or home appliance chip patch repair, BGA special products, chip-level repair tools
Applicable Models: Used for tin planting in cell phone repair, and for BGA tin planting in computers, electronics industry.
Melting Point: 183
Paste: IPX3
Particle: 3#
Features:
1The solder joints are white and full, and there is no cold solder joint or dry joint, and the product has a strong composite force with the soldering iron tip 2The product is an essential product for repairing mobile phones and accurate equipment. also a perfect product for welding on electronic production lines 3This solder paste has a moderate melting point, which is extremely convenient to use 4Solder paste flux can have a long use time when you seal in time after use 5BGA special chiplevel repair tools are suitable for mobile phone chip repair, computer or home appliance chip patch repair
Package List:
5 x Solder Paste Flux
