Specification:
Item Type: Thermoelectric Cooler Module
Model: TEC1-12715
Material: Ceramic + semiconductor
Purpose: Cooling
Wire Specification: Wire Length: Approx. 100mm / 3.9in 5mm, RV standard wire, single head approx. 5mm / 0.2in with tin plated
Internal Resistance: 2.4~2.7 (ambient temperature 231, 1kHZ Ac test)
Dimension: Approx. 40 x 40 x 3.3mm / 1.6 x 1.6 x 0.1in
Maximum Temperature Difference: Tmaximum(Qc=0)>61
Cooling Power: Qcmaximum 150W
Assembly Pressure: 85N/cm
Working Environment: Temperature range -6567 (too high ambient temperature will directly affect the cooling efficiency)
Ambient Temperature: -1040
How to Use:
- The working state of the refrigeration sheet is that one side is cooling and the other is heating.
- To the left of the red line, the upper side is the hot side, and the lower side is the cold side.
Features:
1Can work continuously without any refrigerant, there is no pollution source or rotating parts, no rotation effect, no sliding part. A solid piece without vibration, noise, possess long life and easy installation 2Semiconductor refrigeration film possess two functions of both cooling and heating 3A currenttransducer type chip. Highaccuracy temperature control can be realized through the control of the input current. It is easy to realize remote control, program control, and computer control to form an automatic control system when coupled with temperature detection and control means 4The cooling and heating time is very fast, the thermal inertia of the semiconductor cooling fin is very small, the cooling fin will reach the maximum temperature difference in less than one minute when the hot end has good heat dissipation and the cold end is empty 5Semiconductor refrigeration fins are generally used for power generation in the middle and low temperature areas. Reverse use of semiconductor refrigeration fins is thermoelectric power generation
Package List:
1 x Thermoelectric Cooler Module
