Specification:
Features:
Eco-friendly, bright and full solder joint, little smoke, no irritating smell.
Strong welding force, widely used in all kinds of electronic products.
Easy to weld, no false welding. 25000pcs/bottle for enough use.
Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm
Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.
Specification:
Material: tin
Solder flux content: 63%
Tin ball diameter: 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm (Optional)
Melting point: 183
Operating temperature: 200~380
Bottle size: 35mm / 1.4in (high ); 16mm / 0.6in (width)
Quantity: 25000pcs/bottle
Package List:
1Bottle x Soldering Ball
Note:
There are 25,000 pieces/bottle. The bottle size is fixed. The larger the diameter of the ball, the greater its load.
Features:
1Ecofriendly, bright and full solder joint, little smoke, no irritating smell. 2Strong welding force, widely used in all kinds of electronic products. 3Easy to weld, no false welding. 25000pcs/bottle for enough use. 4Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm 5Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultra-small ball type tin electronic parts.
Package List:
