Product Information:
- Current up to 30A.
- Equipped with heat sink.
- You can directly use the hot bed output signal control of RAMP1.4 and MKS series motherboards.
- Can use 5-24V digital signal control.
Features:
This product is a 3D printer hot bed high power expansion module, carrying a piece
28 28 15MM heat sink. The heat sink completely covers the high power MOS tube on the plate to dissipate heat
More powerful, solve the problem of module heating due to too much power of hot bed. This module, under normal heat dissipation,
When the measured current is 30A, it can work stably for a long time.
Packing list:
Module X1PCS
