Specification:
Features:
Bright and full solder joint, little smoke, no irritating smell.
Less residual, high insulation resistance, high activity, strong welding force.
Can protect BGA traces from corrosion and moisture.
Easy to weld, no false welding. Mainly used in SMT industry.
Suitable for PCB surface resistance, capacitance, IC and other electronic components welding.
Specification:
Viscosity:75 (Pa. S)
Granularity:24-45 (um)
Product size: 37 * 20mm / 1.5 * 0.8in
Alloy component: tin component
Type: Tin pulp
Ingredients: Sn99Ag0.3Cu0.7
Activity: high activity
Melting point: 226~229
Package List:
1 x Solder Paste
Note:
Please note that the new type and old type of this product will be sent randomly, and make sure you will not mind before ordering.
Features:
1Bright and full solder joint, little smoke, no irritating smell. 2Less residual, high insulation resistance, high activity, strong welding force. 3Can protect BGA traces from corrosion and moisture. 4Easy to weld, no false welding. Mainly used in SMT industry. 5Suitable for PCB surface resistance, capacitance, IC and other electronic components welding.
Package List:
