Specification:
Item Type: Solder Balls
Product Composition: Sn63/(tin 63%)
Specification: Approx. 0.55mm / 0.02in 250,000 grains
Uses: Chip planting beads, ball planting
Scope of Application: BGA package soldering, filling, maintenance, ball planting
Features: Add trace elements to improve the oxidation ability and reliability of the solder ball pit.
Description:
The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic signal.
Tin Ball Diameter for IC Packaging: Approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in
Features:
1Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit 2Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic signals with ultrasmall ball tin electronic parts, etc. 3The solder with tin balls is more durable and can help you solder effectively 4A large number, can meet your use and replacement needs, very practically 5Use bottled pack and small size, easy to carry and store, convenient to use and with good performance
Package List:
1 Bottle Solder Balls
