Specification:
Features:
Good moisturizing, bright and full solder joint, little smoke, no irritating smell.
Less residual, high insulation resistance, high activity, strong welding force.
Easy to weld, can protect BGA traces from corrosion and moisture.
Good wetting, dry resistance, long shelf life at room temperature
Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.
Specification:
Viscosity: 200 (Pa. S)
Granularity: 24-45 (um)
Product size: 37 * 20mm / 1.5 * 0.8in
Alloy components: Sn63
Activity: high activity
Melting point: 183
Temperature: 220~380
Package List:
1 x Solder Paste
Features:
1Good moisturizing, bright and full solder joint, little smoke, no irritating smell. 2Less residual, high insulation resistance, high activity, strong welding force. 3Easy to weld, can protect BGA traces from corrosion and moisture. 4Good wetting, dry resistance, long shelf life at room temperature 5Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.
Package List:
