Specification:
Item Type: Low Temperature Flux Paste
Model: SFD-231
Composition: Sn42 Bi58
Granules: 25-45um (No.3 powder)
Weight: 45g/Pcs with Tube
Applicable: Mobile phone CPU IC, etc.
Melting Point: 138
Material: Tin
Features:
1High Performance: Has strong continuous printing performance, suitable for fine pitch IC and BGA and relatively accuracy components welding 2Easy to Use: This low temperature solder paste has good wetting and mold release, and is resistant to cold slump, hot slump and drying 3Application: Suitable for PCB welding of various high demand materials, and rarely phenomenons of tin tombstone displacement 4Less Residue: Full and bright tin beads on tin, less residue, white and transparent, no fluorine and other extremely corrosive substances 5Basic Specifications: The particles are 2545um (No. 3 powder), the ingredients are Sn42, Bi58, used for mobile phone CPU IC, etc.
Package List:
1 x Low Temperature Flux Paste
