Specification:
Item Type: Solder Paste
Applications: Universally used in sensors, wires, even protection tubes, BGA chips, etc.
Product Features: Environmental protection, easy to tin, no residue, high insulation resistance
Capacity: Approx. 100g / 3.5oz
Features:
1HIGH PERFORMANCE: Environmentally friendly soldering paste, which is easy to tin, no residue, with high insulation resistance. 2FOR PACKAGE WORKS: Can be used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to PWB substrates. 3GOOD ADHESION: The solder paste has excellent solder adhesion, moisture resistance, and is suitable for multi PCB reflow soldering. 4PORTABLE DESIGN: With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability. 5WIDE APPLICATION: Used for soldering of sensors, wires, connecting protection tubes, BGA chips, etc., convenient and efficient.
Package List:
1 x Solder Paste
